Dyconex will be exhibiting at this year’s MDM Minneapolis, October 21–22, at booth #3137. The company will highlight its latest capabilities and innovations for implantable flexible printed circuit boards (PCBs) and advanced miniaturization.
Key focus areas at the Dyconex booth:
- Reliability for implantable flexible PCBs: design, manufacturing and testing approaches tailored for long-term implantable use.
- Miniaturization in all three dimensions: line and space capabilities below 10 µm to support next-generation high-density interconnects.
- SAP Technology — Precision in Every Micron: proprietary SAP processes that enable consistent, repeatable precision at micrometer scale.
- Biocompatible flexible substrates: materials and processes optimized for directly implantable applications.
Meet the Dyconex team at booth #3137 to learn how the company’s precision manufacturing and biocompatible materials help medical device developers accelerate development and improve reliability of implantable systems.