Today鈥檚 cutting-edge medical implants demand solutions that fulfill multifunctional requirements like high packaging density, exceptional reliability, and assured signal integrity. As the industry moves toward ever smaller and thinner electronic devices, innovative approaches are essential. Flexible, multilayer PCBs are emerging as the ideal answer to these complex requirements.
This 30-minute webinar will explore how ultra-thin, flexible base materials for PCBs make it possible to design higher-density layouts while achieving advanced miniaturization. By stacking and filling micro vias, these materials help reduce overall package thickness while improving the reliability of interconnect structures, which is backed by proven IST stress test results.
The program also will explore different folding solutions to further minimize device form factors and highlight why gapless traceability at the single-print level is critical for implantable medical devices. An audience Q&A session will follow the technical presentation.
Speaker:
Daniel Schulze, Director of Application Engineering, DYCONEX
Daniel Schulze serves as the Director of the Application Engineering team at DYCONEX AG, focusing on technical consulting and customer support for next-generation flexible, rigid-flex, and rigid ultra-HDI/microvia circuit boards, as well as LCP and advanced chip packaging solutions. He joined DYCONEX AG 鈥� one of the world鈥檚 leading providers of miniaturized, highly complex, and exceptionally reliable interconnect solutions in 2005, and by 2008, he led the Product Engineering group, spearheading product development for advanced medical imaging PCBs, hearing aids, and cochlear implants as well as industrial and high-frequency LCP products. Daniel holds a degree in electrical engineering from the Technical University of Dresden, where his groundbreaking diploma thesis focused on the development of photolithographically structured optical waveguides embedded in PCBs to achieve higher data rates and reduced packaging density. He further advanced his expertise at the prestigious Georgia Tech Packaging Research Center, concentrating on state-of-the-art SOP process development for ultra-high-density interconnects. Daniel鈥檚 extensive knowledge and commitment drive cutting-edge innovations in interconnect technology for critical medical and industrial applications.
Moderator:
Amanda Hosey, Editor, SAE Media Group
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Join us on September 4, 2025 for a concise, 30鈥憁inute online session:
Next鈥慓en 吃瓜黑料网s: Flex PCBs for Better Performance and Reliability
馃暃 12:00鈥痯m U.S. EDT鈥瘄鈥�6:00鈥痯m CEST / MESZ
馃搷 Online
馃挕 Ideal for anyone developing the next generation of medical technology.
馃憠 Register here: